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general description the max2335 rf front-end receiver ic is designed for cdma and ofdm applications in the 450mhz band. the max2335 includes a low-noise amplifier (lna) with adjustable iip3 to minimize desensitization due to cross- modulation in the presence of a large interfering signal. the mixer features differential if outputs and is designed for high linearity and low noise, which is well suited for cdma and ofdm applications. an on-chip frequency divider is included to allow the use of a standard 1ghz vco. alternatively, the divider can be bypassed for use with a lower-frequency vco. the max2335 is available in a 28-pin tqfn package with exposed paddle and is specified for the -40? to +85? extended temperature range. the device is also offered in a lead-free package. features ? 1.5db lna noise figure ? 16db lna gain ? 2.1db cascaded noise figure ? adjustable lna iip3 ? lo output buffer for transmitter ? lo frequency divider ? small 5mm x 5mm, 28-pin (lead-free) tqfn package max2335 450mhz cdma/ofdm lna/mixer ________________________________________________________________ maxim integrated products 1 max2335 top view 2 thin qfn 5mm x 5mm 26 27 25 24 10 9 11 r lna lnain modeo mode1 mode2 12 degen if_cdma+ n.c. buffen ep r bias v cc v cc 12 n.c. 4567 20 21 19 17 16 15 v cc n.c. i.c. n.c. lo_in lo/2 gnd if_cdma- 3 18 28 8 lnaout n.c. n.c. 23 13 lo_out i.c. 22 14 n.c. mixin + pin configuration/ functional diagram ordering information 19-0492; rev 0; 10/05 for pricing, delivery, and ordering information, please contact maxim/dallas direct! at 1-888-629-4642, or visit maxim? website at www.maxim-ic.com. * ep = exposed paddle. + denotes lead-free package. evaluation kit available part temp range pin-package pkg code MAX2335ETI -40? to +85? 28 thin qfn-ep* (5mm x 5mm) t2855-3 MAX2335ETI+ -40? to +85? 28 thin qfn-ep* (5mm x 5mm) t2855+3 applications 450mhz-band, wcdma, is-95, is-2000, ofdm, wireless data links
max2335 450mhz cdma/ofdm lna/mixer 2 _______________________________________________________________________________________ absolute maximum ratings dc electrical characteristics (v cc = +2.9v to +3.3v, r bias = 18k ? , r lna = 24k ? , buffen = low, lo/2 = high, t a = -40? to +85?, unless otherwise noted. typical values are at v cc = +2.9v, low = 0v, high = +3.0v, t a = +25?, unless otherwise noted.) (note 1) stresses beyond those listed under ?bsolute maximum ratings?may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. v cc to gnd ...........................................................-0.3v to +4.3v all other pins to gnd.................................-0.3v to (v cc + 0.3v) ac input pins (lnain, lo_in, mixin) to gnd ...............1v peak continuous power dissipation (t a = +70?) 28-pin thin qfn (derate 34.5mw/? above +70?) ...........2.7w operating temperature range ...........................-40? to +85? junction temperature ......................................................+150? storage temperature range .............................-65? to +150? lead temperature (soldering, 10s) .................................+300? caution! esd sensitive device parameter symbol conditions min typ max units hghl mode (mode[2:0] = 111) 32 38 hgll mode (mode[2:0] = 101) 24 29 operating supply current i cc lg mode (mode[2:0] = 011) 27 31 ma shutdown supply current i cc shutdown mode (mode[2:0] = 000) 0.2 10 ? lo buffer supply current i cc addition for buffen = high 7 13 ma digital input-logic high v ih 2v digital input-logic low v il 0.6 v digital input current (logic-high) i ih 5a digital input current (logic-low) i il -25 ? parameter symbol conditions min typ max units overall performance rf frequency range f rf 420 to 470 mhz lo frequency range f lo after optional lo/2 500 to 660 mhz if frequency range f if 80 to 190 mhz lo input power (note 2) -7 -3 0 dbm lo buffer output power buffen = high -10 -6 dbm return loss all modes, all active ports, including 2-element matching network, if necessary 10 db cascaded performance high-gain, high-linearity mode (mode[2:0] = 111) gain g (note 1) 23.0 27 31.5 db noise figure nf incl ud i ng off- chi p m at chi ng , t a = + 25c ( n ote 2) 2.2 2.6 db input third-order intercept point iip3 t a = + 25c (notes 1, 3) -14 -11.5 dbm ac electrical characteristics (max2335 ev kit, v cc = +2.9v to +3.3v, f lnain = f mixin = 465mhz, f if = 110mhz, f lo = 2 x (f mixin + f if ), 50 ? system impedance, r bias = 18k ? , r lna = 24k ? , cascaded performance includes 2db interstage filter loss, t a = -40? to +85?, unless otherwise noted. typical values are at v cc = +2.9v, p lo_in = -7dbm, low = 0v, high = +3.0v, t a = +25?, unless otherwise noted.)
max2335 450mhz cdma/ofdm lna/mixer _______________________________________________________________________________________ 3 note 1: specifications at t a = +25? and +85? are guaranteed by production test. specifications at t a = -40? are guaranteed by design and characterization. note 2: guaranteed by design and characterization. note 3: two-tone iip3 tested at f rf1 = 465.9mhz and f rf2 = 466.7mhz at -25dbm/tone. ac electrical characteristics (continued) (max2335 ev kit, v cc = +2.9v to +3.3v, f lnain = f mixin = 465mhz, f if = 110mhz, f lo = 2 x (f mixin + f if ), 50 ? system impedance, r bias = 18k ? , r lna = 24k ? , cascaded performance includes 2db interstage filter loss, t a = -40? to +85?, unless otherwise noted. typical values are at v cc = +2.9v, p lo_in = -7dbm, low = 0v, high = +3.0v, t a = +25?, unless otherwise noted.) parameter symbol conditions min typ max units high-gain, low-linearity mode (mode[2:0] = 101) gain g (note 1) 21.0 26.5 30.5 db noise figure nf incl ud i ng off- chi p m at chi ng , t a = + 25c ( n ote 2) 2.1 2.5 db input third-order intercept point iip3 t a = + 25c (notes 1, 3) -15 -12.5 dbm low-gain mode (mode[2:0] = 011) gain g (note 1) 5 9 14 db noise figure nf incl ud i ng off- chi p m at chi ng , t a = + 25c ( n ote 2) 12 15 db input third-order intercept point iip3 t a = + 25c (notes 1, 3) 3 7 dbm lna performance high-gain, high-linearity mode (mode[2:0] = 111) gain g lna 15.5 db noise figure nf lna including off-chip matching 1.7 db input third-order intercept point iip3 lna (note 3) +7 dbm high-gain, low-linearity mode (mode[2:0] = 101) gain g lna 14.5 db noise figure nf lna including off-chip matching 1.5 db input third-order intercept point iip3 lna (note 3) +5 dbm low-gain mode (mode[2:0] = 011) gain g lna -2.7 db noise figure nf lna including off-chip matching 5.5 db input third-order intercept point iip3 lna (note 3) +14 dbm mixer performance high-gain, high-linearity mode (mode[2:0] = 111) gain g mixer 14 db noise figure nf mixer including off-chip matching 7 db input third-order intercept point iip3 mixer (note 3) +2 dbm high-gain, low-linearity mode (mode[2:0] = 101) gain g mixer 13.5 db noise figure nf mixer including off-chip matching 6.7 db input third-order intercept point iip3 mixer (note 3) 0 dbm low-gain mode (mode[2:0] = 011) gain g mixer 14 db noise figure nf mixer including off-chip matching 7 db input third-order intercept point iip3 mixer (note 3) +2 dbm
max2335 450mhz cdma/ofdm lna/mixer 4 _______________________________________________________________________________________ t ypical operating characteristics (max2335 ev kit, v cc = +2.9v, f lnain = 465mhz, f if = 110mhz, f lo_in = 1150mhz, p lo_in = -7dbm, r bias = 18k ? , r lna = 24k ? , t a = +25?, unless otherwise noted.) supply current (hghl) vs. temperature max2335 toc01 temperature ( c) supply current (ma) 60 35 10 -15 28 30 32 34 26 -40 85 lna gain vs rf frequency max2335 toc02 rf frequency (mhz) lna gain (db) 480 460 440 420 -4 0 4 8 12 16 20 -8 400 500 hg lg 6 4 2 0 400 lg hg 440 420 460 480 500 lna noise figure vs. rf frequency max2335 toc03 rf frequency (mhz) lna noise figure (db) 5 6 8 7 9 10 -40 10 -15 35 60 85 lna hghl iip3 vs. temperature max2335 toc04 temperature ( c) lna hghl iip3 (dbm) r lna = 18k ? r lna = 24k ? mixer hghl iip3 vs. temperature max2335 toc05 temperature ( c) mixer hghl iip3 (dbm) 60 35 10 -15 -1 0 1 2 3 4 -2 -40 85 r bias = 18k ? r bias = 24k ? mixer hg noise figure vs. rf frequency max2335 toc06 rf frequency (mhz) mixer hg noise figure (db) 480 460 440 420 6.6 6.8 7.0 6.4 400 500 20 15 10 5 0 2.0 1.5 1.0 0.5 0 0 200 100 300 400 500 mixer if port differential port impedance max2335 toc07 rf frequency (mhz) equivalent parallel resistance (k ? ) equivalent parallel capacitance (pf) capacitance resistance
max2335 450mhz cdma/ofdm lna/mixer _______________________________________________________________________________________ 5 pin description pin name description 1 degen lna degeneration. connect a 1nh to 3nh inductor from degen to ground. 2r lna lna bias. connect an 18k ? to 24k ? resistor from r lna to ground. adjust r lna to adjust the linearity of the input lna in the hghl mode. 3 gnd ground. connect to pc board ground plane using low-inductance vias. 4 lnain rf input. requires a dc-blocking capacitor, which can be used as part of the matching network. 5 mode0 logic input. see table 1. 6 mode1 logic input. see table 1. 7 mode2 logic input. see table 1. 8, 11, 14, 18, 24, 25, 27 n.c. no connection. these pins are internally unconnected. connect to the pc board ground plane. 9 lo/2 logic input. drive low to disable the lo/2. drive high to enable the lo/2. 10 lo_in lo input. internally matched to 50 ? . requires an external dc-blocking capacitor. the lo input frequency can be internally divided by two prior to application to the mixer by driving lo/2 high. 12, 23 i.c. internally connected. leave these pins unconnected for proper operation. 13 lo_out lo buffer output. internally matched to 50 ? . does not require a dc-blocking capacitor. the output frequency of the buffer is equal to the lo frequency divided by two when lo/2 is high, or the lo frequency when lo/2 is low. 15, 16, 26 v cc power supply. bypass pins 16 and 26 to the pc board ground with a capacitor placed as close to the pin as possible. do not share capacitor ground vias with other ground connections. 17 buffen lo output buffer enable. drive high to enable the lo output buffer. drive low to disable the lo output buffer. 19, 20 if_cdma-, if_cdma+ differential if output port. requires pullup inductors to v cc , which can be used as part of the matching network. 21 r bias bias resistor connection. connect an 18k ? to 24k ? r esistor from r bias to ground. adjust r bias to adjust the linearity of the input lna in all modes except hghl and the mixer in all modes. 22 mixin mixer input. requires an external matching network 28 lnaout lna output. requires an external pullup inductor to v cc and a dc-blocking capacitor, both of which can be used as part of the matching network. ?p exposed-paddle ground connection. solder the exposed paddle (ep) evenly to the board? ground plane for proper operation.
max2335 detailed description low-noise amplifiers (lnas) the max2335? lna gain and linearity characteristics can be adjusted using the mode[2:0] inputs. see table 1 for the pin settings for various operating modes. use high-gain, high-linearity mode (hghl) when extra-high linearity is required for cross-modula- tion suppression in the presence of strong interfering signals (e.g., when the system transmitter is on). use high-gain, low-linearity mode (hgll) when the trans- mitter is off and cross-modulation is not a concern, and use low-gain mode (lg) when receiving large signals. r lna can be adjusted to vary the current and linearity of the hghl lna. r bias adjusts the current and the lin- earity of the hgll and lg lna. downconverter the mixer requires a dc-blocking capacitor at the input and pullup inductors at the output. the dc-blocking capacitors and pullup inductors can be designed to be part of the matching circuits. see table 1 for the mode settings for various operating modes. lo output buffer the lo output buffer is internally matched to 50 ? and includes a dc-blocking capacitor. enable the buffer by driving the buffen input high; disable the buffer by driving the buffen input low. the frequency of the buffer output is equal to the lo frequency if the lo/2 input is driven low, or equal to the lo frequency divid- ed by two if lo/2 is driven high. applications information cascaded lna/mixer performance the lna and mixer design optimizes cascaded perfor- mance in all gain and linearity modes. in hghl mode, both the lna and mixer have a low noise figure, high gain, and high linearity. the lna has high gain to mini- mize the noise contribution of the mixer, thus increasing the receiver? sensitivity, and the lna has high linearity for cross-modulation suppression. the hgll mode is used when the transmitter is off and cross-modulation is not a concern. in lg mode, the received signal is strong enough that linearity is the primary concern. the lna gain is reduced to achieve higher system linearity. s-parameters the s-parameters in tables 2, 3, and 4 can be used to design the rf matching circuits. 450mhz cdma/ofdm lna/mixer 6 _______________________________________________________________________________________ function control pins modes lo/1 lo/2 hghl lna hgll lna lg lna hghl mixer hgll mixer mode2 mode1 mode0 lo/2 hghl (lo frequency divided by two) ?? ? 111 1 hgll (lo frequency divided by two) ?? ? 101 1 lg (lo frequency divided by two) ??? 011 1 hghl (lo frequency undivided) ?? ? 111 0 hgll (lo frequency undivided) ??? 101 0 lg (lo frequency undivided) ??? 011 0 shutdown mode 000 x undefined 1x0 x undefined x10 x table 1. operating modes
max2335 450mhz cdma/ofdm lna/mixer _______________________________________________________________________________________ 7 frequency (mhz) s11 (db) s11 ( d eg r e es) s21 (db) s21 ( d eg r e es) s12 (db) s12 ( d eg r e es) s22 (db) s22 ( d eg r ees) 50 -0.693 -20.000 22.265 2.173 -45.196 -39.133 -0.607 55.183 100 -1.302 -38.600 21.655 -41.256 -37.836 -83.956 -0.532 10.563 150 -1.957 -54.244 20.037 -68.340 -33.411 -107.964 -0.819 -11.252 200 -2.407 -68.840 18.300 -89.560 -31.340 -124.383 -1.051 -26.637 250 -2.656 -82.550 16.860 -105.680 -29.466 -136.021 -1.250 -39.640 300 -2.813 -97.830 15.354 -120.500 -28.422 -147.784 -1.420 -51.424 350 -2.959 -112.274 14.262 -133.400 -26.605 -161.620 -1.492 -63.020 400 -2.953 -127.226 12.926 -144.921 -25.600 -172.633 -1.590 -73.860 410 -2.944 -130.500 12.710 -146.900 -25.519 -174.766 -1.630 -76.200 420 -2.914 -133.724 12.530 -149.125 -25.062 -177.340 -1.628 -78.540 430 -2.876 -136.800 12.439 -151.380 -24.960 -179.138 -1.634 -80.612 440 -2.878 -139.320 12.220 -153.900 -24.780 177.020 -1.650 -82.870 450 -2.884 -142.833 12.000 -155.650 -24.500 176.320 -1.665 -84.900 460 -2.850 -145.863 11.820 -158.324 -24.465 173.850 -1.667 -87.422 470 -2.828 -149.000 11.550 -160.300 -24.239 171.027 -1.697 -89.183 480 -2.828 -159.962 11.343 -161.928 -24.180 169.065 -1.711 -91.480 490 -2.811 -155.360 11.150 -163.540 -23.736 167.483 -1.720 -93.335 500 -2.763 -158.386 11.060 -165.000 -23.568 164.144 -1.718 -95.970 550 -2.628 -174.012 10.298 -174.600 -22.850 152.660 -1.756 -107.020 600 -2.444 169.970 9.810 178.350 -21.890 139.530 -1.770 -117.930 650 -2.230 153.600 9.255 170.400 -21.400 128.572 -1.778 -129.730 700 -1.989 137.420 9.200 162.304 -20.375 117.290 -1.776 -141.100 750 -1.733 121.170 9.164 154.522 -20.230 106.200 -1.828 -152.555 800 -1.464 104.500 9.470 146.813 -19.626 94.020 -1.778 -164.610 850 -1.236 87.855 9.690 135.700 -19.430 83.711 -1.810 -176.805 900 -0.978 73.488 10.432 127.430 -18.654 70.714 -1.860 170.521 950 -0.889 53.876 10.613 112.950 -18.512 59.976 -1.887 158.326 1000 -0.858 36.186 11.417 101.010 -17.839 45.167 -2.033 145.377 table 2. max2335 lna s-parameters in hghl mode
max2335 power-supply layout to minimize coupling between different sections of the ic, use a star configuration, which has a large decou- pling capacitor at a central v cc node. the v cc traces branch out from this node, each going to a separate v cc pin of the max2335. at the end of each trace is a bypass capacitor with impedance to ground less than 1 ? at the frequency of interest. this arrangement pro- vides local decoupling at each v cc pin. use at least one via per bypass capacitor for a low-inductance ground connection. also, connect the exposed paddle to the pc board gnd with multiple vias to provide the lowest inductance ground connection possible. matching network layout the layout of a matching network can be very sensitive to parasitic circuit elements. to minimize parasitic inductance, keep all traces short and place compo- nents as close to the ic as possible. use high-q components for the lna input-matching network to achieve the lowest possible noise figure. keep the distance between the differential signal lines at the mixer outputs constant and make both lines of equal length to ensure signal balance. chip information process: sige 450mhz cdma/ofdm lna/mixer 8 _______________________________________________________________________________________ table 3. max2335 mixer input impedance in hghl mode table 4. max2335 mixer output impedance (shunt rc) in hghl mode frequency (mhz) s11 (db) s11 (degrees) 400 -1.2 77.23 410 -1.229 74.52 420 -1.247 71.7 430 -1.24 69.124 440 -1.24 66.47 450 -1.25 63.97 460 -1.28 61.455 470 -1.32 58.68 480 -1.33 55.87 490 -1.35 53.565 500 -1.35 50.87 if frequency (mhz) equivalent shunt resistance (k ? ) equivalent shunt capacitance (pf) 80 17.7 1.21 100 16.961 1.21 120 15.79 1.21 140 14.616 1.21 160 13.49 1.21 190 11.87 1.21
max2335 450mhz cdma/ofdm lna/mixer _______________________________________________________________________________________ 9 t ypical application circuit v cc 465mhz bandpass filter lo input charge- pump output pll input v cc 47nh if out+ if out- 0.01 f 6.8pf 6.8pf 100pf 3.9pf 6800pf v cc v cc 470 ? 1k ? 18k ? 20 ? 18nh 24k ? 1nh 22nh 270nh 270nh 100pf rfpll 19.2mhz tcxo reference input 100pf duplexer 0.01 f 1ghz vco max2335 max2370 2 5 6 4 3 17 16 18 r lna lnain modeo mode1 mode2 modeo mode1 mode2 19 degen if_cdma+ n.c. buffen ep r bias v cc v cc 89 n.c. 11 12 13 14 27 28 26 24 23 22 v cc n.c. lo_in n.c. i.c. lo_out gnd if_cdma- 10 25 7 15 lnaout n.c. n.c. 2 20 lo/2 i.c. 1 21 n.c. mixin + v cc v cc 1000pf 100pf 100pf 22 f lo buffer enable pa
pa cka ge information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation go to www.maxim-ic.com/packages .) qfn thin.eps d2 (nd-1) x e e d c pin # 1 i.d. (ne-1) x e e/2 e 0.08 c 0.10 c a a1 a3 detail a e2/2 e2 0.10 m c a b pin # 1 i.d. b 0.35x45 d/2 d2/2 l c l c e e l c c l k l l detail b l l1 e aaaaa marking i 1 2 21-0140 package outline, 16, 20, 28, 32, 40l thin qfn, 5x5x0.8mm -drawing not to scale- l e/2 max2335 450mhz cdma/ofdm lna/mixer 10 ______________________________________________________________________________________
max2335 450mhz cdma/ofdm lna/mixer maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circu it patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 ____________________ 11 2005 maxim integrated products printed usa is a registered trademark of maxim integrated products, inc. common dimensions max. exposed pad variations d2 nom. min. min. e2 nom. max. ne nd pkg. codes 1. dimensioning & tolerancing conform to asme y14.5m-1994. 2. all dimensions are in millimeters. angles are in degrees. 3. n is the total number of terminals. 4. the terminal #1 identifier and terminal numbering convention shall conform to jesd 95-1 spp-012. details of terminal #1 identifier are optional, but must be located within the zone indicated. the terminal #1 identifier may be either a mold or marked feature. 5. dimension b applies to metallized terminal and is measured between 0.25 mm and 0.30 mm from terminal tip. 6. nd and ne refer to the number of terminals on each d and e side respectively. 7. depopulation is possible in a symmetrical fashion. 8. coplanarity applies to the exposed heat sink slug as well as the terminals. 9. drawing conforms to jedec mo220, except exposed pad dimension for t2855-3 and t2855-6. notes: symbol pkg. n l1 e e d b a3 a a1 k 10. warpage shall not exceed 0.10 mm. jedec 0.70 0.80 0.75 4.90 4.90 0.25 0.25 0 -- 4 whhb 4 16 0.35 0.30 5.10 5.10 5.00 0.80 bsc. 5.00 0.05 0.20 ref. 0.02 min. max. nom. 16l 5x5 l 0.30 0.50 0.40 -- - -- - whhc 20 5 5 5.00 5.00 0.30 0.55 0.65 bsc. 0.45 0.25 4.90 4.90 0.25 0.65 - - 5.10 5.10 0.35 20l 5x5 0.20 ref. 0.75 0.02 nom. 0 0.70 min. 0.05 0.80 max. -- - whhd-1 28 7 7 5.00 5.00 0.25 0.55 0.50 bsc. 0.45 0.25 4.90 4.90 0.20 0.65 - - 5.10 5.10 0.30 28l 5x5 0.20 ref. 0.75 0.02 nom. 0 0.70 min. 0.05 0.80 max. -- - whhd-2 32 8 8 5.00 5.00 0.40 0.50 bsc. 0.30 0.25 4.90 4.90 0.50 - - 5.10 5.10 32l 5x5 0.20 ref. 0.75 0.02 nom. 0 0.70 min. 0.05 0.80 max. 0.20 0.25 0.30 down bonds allowed yes 3.10 3.00 3.20 3.10 3.00 3.20 t2055-3 3.10 3.00 3.20 3.10 3.00 3.20 t2055-4 t2855-3 3.15 3.25 3.35 3.15 3.25 3.35 t2855-6 3.15 3.25 3.35 3.15 3.25 3.35 t2855-4 2.60 2.70 2.80 2.60 2.70 2.80 t2855-5 2.60 2.70 2.80 2.60 2.70 2.80 t2855-7 2.60 2.70 2.80 2.60 2.70 2.80 3.20 3.00 3.10 t3255-3 3 .20 3.00 3.10 3.20 3.00 3.10 t3255-4 3 .20 3.00 3.10 no no no no yes yes yes yes 3.20 3.00 t1655-3 3.10 3.00 3.10 3.20 no no 3.20 3.10 3.00 3.10 t1655n-1 3.00 3.20 3.35 3.15 t2055-5 3.25 3.15 3.25 3.35 yes 3.35 3.15 t2855n-1 3.25 3.15 3.25 3.35 no 3.35 3.15 t2855-8 3.25 3.15 3.25 3.35 yes 3.20 3.10 t3255n-1 3.00 no 3.20 3.10 3.00 l 0.40 0.40 ** ** ** ** ** ** ** ** ** ** ** ** ** ** see common dimensions table 0.15 11. marking is for package orientation reference only. i 2 2 21-0140 package outline, 16, 20, 28, 32, 40l thin qfn, 5x5x0.8mm -drawing not to scale- 12. number of leads shown are for reference only. 3.30 t4055-1 3.20 3.40 3.20 3.30 3.40 ** yes 0.05 0 0.02 0.60 0.40 0.50 10 ----- 0.30 40 10 0.40 0.50 5.10 4.90 5.00 0.25 0.35 0.45 0.40 bsc. 0.15 4.90 0.25 0.20 5.00 5.10 0.20 ref. 0.70 min. 0.75 0.80 nom. 40l 5x5 max. 13. lead centerlines to be at true position as defined by basic dimension "e", 0.05. t1655-2 ** yes 3.20 3.10 3.00 3.10 3.00 3.20 t3255-5 yes 3.00 3.10 3.00 3.20 3.20 3.10 ** exceptions package information (continued) (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation go to www.maxim-ic.com/packages .)

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